Li-valve block / Semiconductor thepa e nepahetseng karolo ea Setšoantšo se bontšitsoeng

Karolo e nepahetseng ea lisebelisoa tsa valve block / Semiconductor

Tlhaloso e Khutšoanyane:

Karolo ea lebitso:Karolo e nepahetseng ea phala ea welding/Semiconductor equpment

Boitsebiso:Motsoako oa aluminium

Phekolo ea Bokaholimo:N/A

Tsamaiso e ka Sehloohong:Phetoho / Setsi sa Machining

MOQ:Rera Litlhoko tsa Selemo le Selemo le Nako ea Bophelo ba Sehlahisoa

Ho nepahala ha mochini:± 0.005mm

Ntlha ea Bohlokoa:Bophara ba lesoba le ka hare la block valve ke le lenyenyane, litlhoko tsa sesebelisoa le abrasive li phahame, 'me ho sebetsa ho thata.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tlhaloso

Valve ea lisebelisoa tsa semiconductor ke karolo ea bohlokoahali indastering ea semiconductor.Ts'ebetso ea eona ea tlhahiso le theknoloji e amanang le eona e hloka ts'ebetso e nepahetseng e phahameng le taolo e tiileng ea boleng.Ts'ebetsong ea tlhahiso ea semiconductor, li-valve tsa lisebelisoa tsa semiconductor li ka fihlela taolo e nepahetseng ea khase le metsi ho netefatsa botsitso le litlhoko tse nepahetseng tsa lihlahisoa tsa semiconductor.Ho sebetsa ka nepo, moralo oa CAD, mochini oa CNC, kalafo ea mocheso, kalafo ea holim'a metsi le mahlale a mang ke likhokahano tsa bohlokoa ts'ebetsong ea tlhahiso ea li-valve tsa lisebelisoa tsa semiconductor.

Kopo

Li-valve li bapala karolo ea bohlokoa haholo lits'ebetsong tsa semiconductor tse hloekileng haholo.E ka laola ho phalla, khatello, tataiso le mocheso oa mokelikeli, ho netefatsa bohloeki le botsitso ba mokelikeli, e le ho netefatsa boleng le botsitso ba lihlahisoa tsa semiconductor le ho finyella litlhoko tsa ts'ebetso ea tlhahiso.

Ts'ebetso e Tloaelehileng ea Likarolo tsa ho sebetsa ka mokhoa o nepahetseng haholo

Mokhoa oa mechine	Khetho ea Lisebelisoa		Qetella Khetho
CNC Milling Ho fetoha ha CNC CNC Ho sila Precision Wire Cutting	Motsoako oa aluminium	A6061,A5052,2A17075, joalo-joalo.	Ho roala	Sekoti se entsoeng ka galvanized, Gold Plating, Nickel Plating, Chrome Plating, Zinc nickel alloy, Titanium Plating, Ion Plating
	Ts'epe e sa beng le mabali	SUS303,SUS304,SUS316,SUS316L,SUS420,SUS430,SUS301, joalo-joalo.	Anodized	Oxidation e thata, e Hlakileng ea Anodized, ea Anodized ea Mmala
	Tšepe ea carbon	20#,45#, joalo-joalo.	Ho roala	Ho roala ka Hydrophilic, Ho roala ha Hydrophobic, Vacuum coating, Diamond Like Carbon (DLC), PVD (Golden TiN; Black: TiC, Silver: CrN)
	Tšepe ea tungsten	YG3X,YG6,YG8,YG15,YG20C,YG25C	Ho roala
	Lintho tse entsoeng ka polymer	PVDF,PP,PVC,PTFE,PFA,FEP,ETFE,EFEP,CPT,PCTFE,PEEK	Ho benya	Ho bentša ka mochini, ho bentša ka electrolytic, ho bentša ka lik'hemik'hale le ho bentša nano

Bokhoni ba ho sebetsa

Thekenoloji	Lenane la Mechini		Tshebeletso
CNC Milling Ho fetoha ha CNC CNC Ho sila Precision Wire Cutting	Mechining ea li-axis tse hlano Axis tse nne tse Horizontal Axis e Nne e Emeng Mokhoa oa ho sebetsa oa Gantry High Speed Drilling Machining Li-axis tse tharo Ho Tsamaea ka Konokono Mofepi wa Dithipa CNC Lathe Lath e otlolohileng Selo se seholo sa Metsi Ho Sila Sefofane Ho Sila ka hare le ka ntle terata e mathang ka nepo EDM-mekhoa Ho poma ka terata		Sebaka sa Tšebeletso: Prototype & Mass Production Tlhahiso e potlakileng :5-15Matsatsi Ho nepahala: 100 ~ 3μm Qetello: E etselitsoe kopo Taolo ea Boleng e Tšepahalang:IQC,IPQC,OQC

Lipotso Tse Botsoang Hangata

1.Potso: Ke mefuta efe ea likarolo tsa lisebelisoa tsa semiconductor tseo u ka li sebetsanang?
Karabo: Re ka sebetsana le mefuta e sa tšoaneng ea likarolo tsa lisebelisoa tsa semiconductor, ho kenyelletsa le lisebelisoa, li-probes, li-contacts, li-sensor, lipoleiti tse chesang, likamore tsa vacuum, joalo-joalo Re na le lisebelisoa tse tsoetseng pele tsa ho sebetsa le theknoloji ho finyella litlhoko tse khethehileng tse khethehileng tsa bareki.

2.Potso: Nako ea hau ea ho fana ka nako e kae?
Karabo: Nako ea rona ea ho fana e tla itšetleha ka ho rarahana, bongata, thepa le litlhoko tsa bareki ba likarolo.Ka kakaretso, re ka qeta tlhahiso ea likarolo tse tloaelehileng ka matsatsi a 5-15 ka potlako.Bakeng sa lihlahisoa tse nang le bothata bo rarahaneng ba ho sebetsa, re ka leka ka hohle ho khutsufatsa nako ea ho etella pele e le kopo ea hau.

3.Potso: Na u na le bokhoni ba ho hlahisa ka botlalo?
Karabo: E, re na le mela e sebetsang hantle ea tlhahiso le lisebelisoa tse tsoetseng pele tsa othomathike ho fihlela tlhokahalo ea boleng bo holimo, tlhahiso ea likarolo tsa boleng bo holimo.Re ka boela ra theha merero e feto-fetohang ea tlhahiso ho latela litlhoko tsa bareki ho ikamahanya le tlhoko ea 'maraka le liphetoho.

4.Potso: Na o ka fana ka tharollo e hlophisitsoeng?
Karabo: E, re na le sehlopha sa litsebi tsa setsebi le lilemo tsa phihlelo ea indasteri ho fana ka litharollo tse hlophisitsoeng ho latela litlhoko le litlhoko tse khethehileng tsa bareki.Re ka sebetsa haufi-ufi le bareki ho utloisisa litlhoko tsa bona ka botebo le ho fana ka tharollo e loketseng ka ho fetisisa.

5.Potso: Mehato ea hau ea ho laola boleng ke efe?
Karabo: Re nka mehato e tiileng ea taolo ea boleng ts'ebetsong ea tlhahiso, ho kenyeletsoa tlhahlobo e tiileng le liteko mohatong o mong le o mong ho tloha ho theko ea thepa e tala ho isa tlhahisong ea sehlahisoa ho netefatsa boleng ba sehlahisoa le ho latela litekanyetso le litlhoko tsa setifikeiti.Re boetse re etsa tlhahlobo le litlhahlobo khafetsa tsa boleng ba kahare le kantle ho netefatsa ntlafatso e tsoelang pele le ntlafatso.

6.Potso: O na le sehlopha sa R&D?
Karabo: E, re na le sehlopha sa R&D se ikemiselitseng ho etsa lipatlisiso le ho nts'etsapele mahlale a morao-rao le lits'ebetso ho fihlela litlhoko tsa bareki le mekhoa ea 'maraka.Re boetse re sebelisana 'moho le liunivesithi tse tsebahalang le litsi tsa lipatlisiso ho etsa lipatlisiso tsa mebaraka.

E fetileng: Karolo e nepahetseng ea phala ea welding/Semiconductor

E 'ngoe: UAV pan-tilt motor sekoahelo / karolo e nepahetseng ea lisebelisoa tsa sefofane

Ngola molaetsa wa hao mona mme o re romele wona